The FlexTiles Platform was inspired by the EU FP7 Project "FlexTiles". The ultimate goal is to be able to design Multi-Core and Heterogeneous "System-on-Chips", combining DSPs, Conventional CPUs, GPUs and application specific re-configurable logic-blocks, stacked into a 3D array of silicon.
The FlexTiles Development Platform is the 6th generation of "Rapid Prototype" system designed by Sundance Multiprocessor Technology to integrate Xilinx FPGAs and Texas Instruments DSPs. It is now the most versatile and flexible to date.
The FlexTiles Platform will provide an ideal test bench for such "Real-Life" simulations with its very large FPGAs, Multiple I/O standards and optional piggy-back I/O Modules, either based on the TIM-40 (Texas Instrument Modules) Modules or the new standard for I/O Module, the VITA-54 FMC Module.